The sensor is designed and manufactured based on ceramic piezoresistive effect or silicon piezoresistive effect and MEMS and application specific integrated circuit (ASIC) technology. The processing circuit adopts German imported chip.
Learn moreThis sensor is based on ceramic piezoresistive or silicon piezoresistive effect and is designed and manufactured by using micro-melting and ASIC technology The processing circuit adopts gauge chip, and the pressure chip and lead are protected by sil
Learn moreThis sensor is based on ceramic piezoresistive or silicon piezoresistive effect and is designed and manufactured by using micro-melting and ASIC technology The processing circuit adopts gauge chip, and the pressure chip and lead are protected by sil
Learn moreThe MAP intake manifold pressure sensor uses a varistor silicon chip sensor core, the seal is connected with the manifold, the vacuum seal is above the silicon chip, and the manifold (atmospheric) pressure is below the silicon chip
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